Taller, Lower, More Complex – how to master tomorrow’s inspection challenges : Wednesday, 16th June 2021 - 3PM CET
New challenges and more demanding production are on the rise in the electronic industry. Press fit components, tall components, PCB on jigs and more flexible PCB’s are becoming widely used, and the optical inspection systems need to follow these trends. Find out how the latest innovations in 3D AOI can help you reliably overcome these challenges with ease.
You will learn from the webinar
- How to perform 3D inspection on inserted press-fit component
- How to achieve deeper inspection capability for PCB in jig operation which may have surface height variables
- How to perform accurate OCR, COV, polarity and height inspection on tall components with one perfectly focused and sharp image from the PCB surface to the top of the component.
Title: Technology Sales Engineer
Biography: André Corte started his career as a Mechanical Engineer in Industrial Maintenance and Management. In 2018 joined SAKI Europe as an Application Engineer and gained experience in SPI, AOI and AXI. He later became part of the Technology Sales team, where he is engaged in product demonstration, evaluation, and product development for the whole SAKI line up.